Feature 1APPLICABLE MODELS: Designed specifically for Orange Pi Zero 3, with precise cut outs to correspond to the applicable models, ensuring unobstructed operation. 2PASSIVE COOLING: The Cooling case utilizes passive cooling technology to effectively improve motherboard efficiency and maintain better performance. 3FAST CONDUCTION: Thermal adhesive design ensures fast heat conduction and strengthens the tight connection between the enclosure case and the motherboard. 4STABLE OPERATION: Cooling heatsink can help reduce the motherboard temperature and maintain stable performance operation. 5ALUMINUM ALLOY: Enclosure case is made of aluminum alloy, which is a strong and durable shell that effectively defend the motherboard from external shocks and damages.Item Type:AluminiumAlloyCaseforOrangePiZero3Material: Aluminum AlloyModel: for Orange Pi Zero 3 .wang-edit-text{ font-family:'Arial' !important; } .wang-edit-text table { border-top: 1px solid #000; border-left: 1px solid #000; } .wang-edit-text table td, .wang-edit-text table th { border-bottom: 1px solid #000; border-right: 1px solid #000; padding: 3px 5px; } .wang-edit-text table th { text-align: center; }Package List1 x Top Cover1 x Base Plate1 x Screw Kit