1 Introduction. - 2 Current Manufacturing Techniques. - 3 The Network The Physical Transmission Medium. - 3. 1 Basic communications. - 3. 2 Communications options. - 3. 3 Distributed LANs. - 3. 4 Head ends. - 4 The Seven Layer Model. - 4. 1 The application itself. - 4. 2 Applications layer (layer 7). - 4. 3 Presentation layer (layer 6). - 4. 4 Session layer (layer 5). - 4. 5 Transport layer (layer 4). - 4. 6 Network layer (layer 3). - 4. 7 Datalink layer (layer 2). - 4. 8 Physical layer (layer 1). - 4. 9 Interconnecting MAP and TOP with each other and with other systems. - 4. 10 Technical and Office Protocols (TOP). - 5 The Standards Scene. - 5. 1 The origins of OSI. - 5. 2 The International Standards Organization (ISO). - 5. 3 ISO stages of development of standards. - 5. 4 National activity in the UK. - 5. 5 Who's who in standards. - 6 Key Issues. - 6. 1 The functionality of MMS. - 6. 2 Interoperability. - 6. 3 Testing. - 7 Map and Top Application Case Studies. - 7. 1 The Towers of Hanoi and beyond. - 7. 2 Cell controller applications. - 7. 3 A link from design to assembly and inspection. - 7. 4 MAP in the electronics test environment. - 7. 5 AIMS an Assembly Information Management System applied to engine assembly. - 7. 6 Using MAP in the factory. - 7. 7 MAP in printed circuit board assembly. - 7. 8 Communications in the aerospace industry. - 7. 9 MAP in General Motors. - 8 The Way Ahead. - 8. 1 The future. - 8. 2 MAP and TOP products. - Useful Addresses. - Abbreviations. - Sources and Recommendations for Further Reading. Language: English