•【Intelligent Desoldering】 Advanced temperature control prevents motherboard damage,with an alarm system to avoid overheating •【Large Operating Area】 Supports desoldering operations on larger motherboards,offering excellent compatibility and efficiency •【Precise Temperature Management】 Clear temperature display with adjustable controls for optimal performance •【Rapid Heating Technology】 Features fast temperature rise,long lifespan,and uniform heat distribution for efficient operations •【Versatile Compatibility】 Supports separation of Android and iPhone X-15PM series motherboards,screen brackets,with continuous updates for future models •【Innovative Design】 Strong magnetic adsorption with multiple built-in magnets for easy handling and disassembly •【Enhanced Fit】 Synthetic stone compression clasp ensures better motherboard fitting during operations Specifications: •Heating Area: Extra large,suitable for Android phones and larger motherboards •Temperature Control: Precise,with adjustable settings •Display: Temperature readout •Alarm System: Audible alert when preset temperature is reached •Compatibility: Android and iPhone X-15PM series motherboards •Design Features: Magnetic adsorption,no snaps •Additional Feature: Synthetic stone compression clasp •Heat Dissipation: Improved air duct design for better cooling Compatible with: •Universal Package included: •1 x L2023 Desoldering Station •1 x Universal Platform •1 x iP X-11 Series Heating Mold •1 x iP 12/12P/12PM/12mini Heating Mold •1 x iP 13/13/13PM/13mini Heating Mold •1 x iP 14 Series Heating Mold •1 x iP 15 Series Heating Mold •1 x Power Cord